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| Fast Recovery Epitaxial Diode (FRED) DSEI 36 VRRM = 600 V IFAVM = 37 A trr = 35 ns VRSM V 600 VRRM V 600 Type A C TO-263 AA NC A DSEI 36-06AS C (TAB) A = Anode, C = Cathode, NC = No connection, TAB = Cathode Symbol IFRMS IFAVM yyx IFRM IFSM Test Conditions TVJ = TVJM TC = 85C; rectangular, d = 0.5 tP < 10 ms; rep. rating, pulse width limited by TVJM TVJ = 45C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine Maximum Ratings 70 37 375 300 320 260 280 450 420 340 320 -40...+150 150 -40...+150 TC = 25C 125 2 A A A A A A A A2s A2s A2s A2s C C C W g TVJ = 150C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine I2t TVJ = 45C t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine Features International standard surface mount package JEDEC TO-263 AA Planar passivated chips Very short recovery time Extremely low switching losses Low IRM-values Soft recovery behaviour Epoxy meets UL 94V-0 q q q q q q q TVJ = 150C; t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine TVJ TVJM Tstg Ptot Weight TO-263 AA Outline Symbol Test Conditions typ. Characteristic Values max. 100 50 7 1.4 1.6 1.01 7.1 1.0 mA mA mA V V V mW K/W ns A Dim. A A1 b b2 c c2 D D1 E E1 e L L1 L2 L3 L4 R Millimeter Min. Max. 4.06 2.03 0.51 1.14 0.46 1.14 8.64 7.11 9.65 6.86 2.54 14.61 2.29 1.02 1.27 0 0.46 4.83 2.79 0.99 1.40 0.74 1.40 9.65 8.13 10.29 8.13 BSC 15.88 2.79 1.40 1.78 0.38 0.74 Inches Min. Max. .160 .080 .020 .045 .018 .045 .340 .280 .380 .270 .100 .575 .090 .040 .050 0 .018 .190 .110 .039 .055 .029 .055 .380 .320 .405 .320 BSC .625 .110 .055 .070 .015 .029 008 IR TVJ = 25C TVJ = 25C TVJ = 125C IF = 37 A; VR = VRRM VR = 0.8 * VRRM VR = 0.8 * VRRM TVJ = 150C TVJ = 25C VF VT0 rT RthJC trr IRM For power-loss calculations only TVJ = TVJM IF = 1 A; -di/dt = 100 A/ms; VR = 30 V; TVJ = 25C VR = 350 V; IF = 30 A; -diF/dt = 240 A/ms L 0.05 mH; TVJ = 100C 35 10 50 11 Characteristic curves are located in the data sheet DSEI 30-06A. x IFAVM rating includes reverse blocking losses at TVJM, VR = 0.8 VRRM, duty cycle d = 0.5 Data according to IEC 60747 IXYS reserves the right to change limits, test conditions and dimensions (c) 2000 IXYS All rights reserved 1-1 |
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